mounting pad

См. также в других словарях:

• die pad — lustų montavimo aikštelė statusas T sritis radioelektronika atitikmenys: angl. chip mounting area; die pad; die mounting area vok. Chipbondfläche, f; Chipmontagefläche, f rus. площадка для монтажа кристаллов ИС, f pranc. palier de montage de la… …   Radioelektronikos terminų žodynas

• chip-mounting area — lustų montavimo aikštelė statusas T sritis radioelektronika atitikmenys: angl. chip mounting area; die pad; die mounting area vok. Chipbondfläche, f; Chipmontagefläche, f rus. площадка для монтажа кристаллов ИС, f pranc. palier de montage de la… …   Radioelektronikos terminų žodynas

• die-mounting area — lustų montavimo aikštelė statusas T sritis radioelektronika atitikmenys: angl. chip mounting area; die pad; die mounting area vok. Chipbondfläche, f; Chipmontagefläche, f rus. площадка для монтажа кристаллов ИС, f pranc. palier de montage de la… …   Radioelektronikos terminų žodynas

• Contact pad — Gold wire ball bonded to a gold contact pad Contact pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, Flip chip mounting, or probe… …   Wikipedia

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• Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia